ESSCI and SEEDAP Partner to Equip Youth with Industry-Ready Skills in Andhra Pradesh

New Delhi: Electronics Sector Skills Council of India (ESSCI) and The Society for Employment Generation and Enterprise Development in Andhra Pradesh (SEEDAP) have signed a Memorandum of Understanding (MoU) to empower young talent with industry-relevant skills in the electronics sector. This landmark agreement, signed by Mr. Saleem Ahmed, Officiating CEO of ESSCI, and Mr. Srinivasulu, CEO of SEEDAP, is set to strengthen the employability of students across Andhra Pradesh, creating new avenues for growth and expertise in the state’s electronics workforce.

The signing ceremony, attended by prominent leaders such as SEEDAP Chairman Sri G. Deepak Reddy, Mr. Saroj Apato, Vice President of ESSCI, Mr. Lalu Dharavath, Regional Head of ESSCI, and Mr. Sunil, MD of Shri Technologies, underscores a shared commitment to fostering industry-ready competencies among the youth. This collaboration will facilitate specialized training programs, aligning education with real-world requirements and driving economic development in the region.

Speaking on the occasion, Mr. Saleem Ahmed, Officiating Head of ESSCI, said, “Our partnership with SEEDAP represents a pivotal step in advancing skill development in Andhra Pradesh. Through this collaboration, we aim to create a skilled workforce that meets industry demands, opening up meaningful career opportunities for young professionals in the electronics sector.”

With the combined efforts of ESSCI and SEEDAP, this MoU promises a robust framework for skill enhancement, ensuring a brighter and more capable future workforce in Andhra Pradesh.