IESA and IEEE-EPS conclude First Workshop on Advanced Semiconductor Packaging
Bangalore : The India Electronics and Semiconductor Association (IESA), India’s leading industry association for Semiconductors and ESDM (Electronics System Design and Manufacturing) sector, today concluded the 1st edition of the Advanced Semiconductor Packaging Workshop. The two-day event, conducted in association with IEEE Electronics Packaging Society (IEEE-EPS), USA, witnessed participation from the government, renowned global leaders and professionals from the industry, members of academia, policymakers, entrepreneurs and students.
Dr. Aswath Narayan, the Hon’ble Minister for Electronics, IT/BT and Skill Development, Government of Karnataka, spoke passionately about how the state of Karnataka and India is eagerly waiting for the operationalization of the Fab and ATMP units, with steps the Government of India and the Government of Karnataka are taking with the right policies and enablers to make this happen. Addressing the workshop, Ms. Gunjan Krishna, IAS, Commissioner for Industries & Commerce, spoke in detail of the ecosystem components that goes into an ATMP/OSAT and how the state of Karnataka is working in tandem with the Government of India to get it set up once the proposals submitted are evaluated and approved. She also emphasized upon the need for growth of R&D in deep technology and explained how ready the government is for supporting the needs of the ESDM industry.
The workshop was addressed by Sh Amitesh Sinha, JS (E), MeitY as well as Mrs Sunita Verma, Scientist ‘G’ and Group Coordinator R&D in MeitY. Both the talks were very well received by the audience and participants. Business leaders who addressed the workshop included Mr. Vivek Tyagi, Chairman – IESA, Mr. Sam Karikalan, VP – IEEE-EPS and Executive Chair of the Workshop, Mr. K. Krishna Moorthy, CEO & President, IESA, and Suresh Subramaniam, General Chair of the Workshop.
The two-day Advanced Semiconductor Packaging Workshop was a first-of-its kind event, conducted by IESA and was aimed at fostering innovation in the semiconductor packaging segment. The workshop also marked the very first collaboration between IESA and IEEE-EPS, the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.